The process excels in precise operations in many fields such as electronics and semiconductors, providing stable and reliable adsorption solutions for your production processes.
| Name | L（mm） | A（mm） | B（mm） | A(mil) | Item Name |
| Spring Nozzle | 10.8 | 0.076 | 0.167 | 3 | Spring Nozzle 4 |
| 10.8 | 0.069 | 0.161 | 2.7 | Spring Nozzle 5 | |
| 10.8 | 0.088 | 0.23 | 3.5 | Spring Nozzle6 | |
| 10.8 | 0.065 | 0.19 | 2.56 | Spring Nozzle12 | |
| 10.8 | 0.075 | 0.21 | 2.95 | Spring Nozzle13 | |
| 10.8 | 0.095 | 0.23 | 3.74 | Spring Nozzle14 | |
| 10.8 | 0.069 | 0.2 | 2.72 | Spring Nozzle15 |
Our company specializes in the production of semiconductors a variety of spring nozzle, can be customized according to customer drawings, production of one-stop service.
- High quality, high life, high quality to meet the semiconductor traditional packaging industry
- By controlling the strength of the spring, it reduces the damage, indentation brought to the LED chip when sucking the crystal.
- Can improve the yield of semiconductor packaging products, improve UPH, reduce the frequency of personnel replacement.
- Spring suction nozzle has the characteristics of high temperature resistance, abrasion resistance, corrosion resistance, insulation, anti-static and so on.
- Long service life, its hardness is second only to diamond, wear-resistant and durable.
Structural optimization
Bionic spring design: Helical or corrugated structure enhances the elastic deformation range (strain 0.1% → 0.5%).
Cushioning layer integration: Silicone or polyurethane coating absorbs impact loads and reduces the risk of brittle fracture.
Machining accuracy
Bore machining: bore tolerance ±0.002mm, taper <0.001° to ensure vacuum adsorption stability.
Surface treatment: diamond-like (DLC) coating, the coefficient of friction is reduced to 0.02, prolonging the life.
Adaptation to
High vacuum environment: select dense sintered ceramics (porosity <0.1%) to prevent microporous air leakage.
