CompressiveStrength
Thermal Expansion
Advanced ceramics have generally low coefficients of thermal expansion which is the measure of how much a material expands due to a rise in temperature.When heat is applied to most materials they expand due to their atomic structure, ceramics due to their atomic composition are able to stay stable across a wider range of temperatures. Advanced ceramics have half the coefficients of thermal expansion when compared to metals like stainless steel, and this low thermal expansion can be used to advantage on designing assemblies where ceramics can be kept in compression to enhance its mechanical strength.
Important Materials for Thermal Expansion<br>(CTE 25°C ➞ 400°C)
In terms of thermal expansion, Zirconia and Alumina rank on the higher end and Silicon Nitride and Silicon Carbide are on the lower end. With a range of materials and grades in our portfolio with varying characteristics, materials like Shapal Hi M soft with its close expansion match to silicon works well in semiconductor applications.
Aluminum Nitride (AlN) – PCAN1000
4.5 [10-6/K]
PCAN1000 is our standard high purity aluminium nitride with a thermal conductivity of 170 W/ (m.K). This is the same thermal performance as our substrate material but offers the possibility of larger pieces in length and width and in thicknesses up to 30mm.
Related Properties
Thermal Conductivity
Thermal conductivity measures how easily heat is transmitted through amaterial. There is a growing specialist market for advanced ceramics usein applications with high thermal conductivity requirements.
Maximum Temperature
Advanced ceramics are well known for their heat withstanding propertiesin which they only start to melt at temperatures around 2000’c.incomparison to more common ceramic materials such as tile or brick, theystart to melt at temperatures around 650’C.